Experiment on evaporation heat transfer performance of porous surface

2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) Pub Date : 2016-07-20 DOI:10.1109/ITHERM.2016.7517520

S. Hirasawa, T. Nakajima, Tetsuya Urimoto, Yuya Tsujimoto, Y. Takeuchi, T. Kawanami, K. Shirai

{"title":"Experiment on evaporation heat transfer performance of porous surface","authors":"S. Hirasawa, T. Nakajima, Tetsuya Urimoto, Yuya Tsujimoto, Y. Takeuchi, T. Kawanami, K. Shirai","doi":"10.1109/ITHERM.2016.7517520","DOIUrl":null,"url":null,"abstract":"Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.","PeriodicalId":426908,"journal":{"name":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","volume":"24 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2016-07-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ITHERM.2016.7517520","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}

引用次数: 1

Abstract

Enhancement of evaporation heat transfer performance is important for cooling of electronic devices. Evaporation heat transfer coefficient of two types of porous surfaces supplied with water liquid film was studied experimentally. First porous surface was multi layers of meshed plates with micro-channel of 0.3 mm width. Thin water liquid film was supplied to the porous surface by bubbles. Evaporation heat transfer coefficient of the porous surface with one or two layers of meshed plates was 8×104 W/m2K and it was higher than pool boiling heat transfer coefficient. Second porous surface was 1 mm thickness of glass-beads of 0.4 mm in diameter on a heated cupper plate. Water was supplied to the porous layer at the center of the plate. Evaporation heat transfer coefficient was 1000 W/m2K after water was supplied. Evaporation heat transfer coefficient increased to 7000 W/m2K before appearance of dry portion on the plate, because water film thickness in the porous layer was thin.

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多孔表面蒸发换热性能实验研究

提高蒸发换热性能对电子器件的冷却具有重要意义。实验研究了两种有水液膜的多孔表面的蒸发换热系数。第一个多孔表面为多层网状板，微通道宽度为0.3 mm。通过气泡向多孔表面提供薄的水液膜。一层或两层网板多孔表面的蒸发换热系数为8×104 W/m2K，且高于池沸腾换热系数。第二个多孔表面是加热后的铜板上直径为0.4 mm、厚度为1mm的玻璃微珠。水被供给到板中央的多孔层。给水后的蒸发换热系数为1000w /m2K。在板上出现干燥部分之前，由于多孔层的水膜厚度较薄，蒸发换热系数增加到7000 W/m2K。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2016 15th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)

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