III-V/Si integration: potential and outlook for integrated low power micro and nanosystems

S. Yoon
{"title":"III-V/Si integration: potential and outlook for integrated low power micro and nanosystems","authors":"S. Yoon","doi":"10.1145/1629395.1629399","DOIUrl":null,"url":null,"abstract":"Integration of III-V compound semiconductors with silicon on a monolithic platform has been a long term vision for the semiconductor industry. In the past, this concept began as a simple notion that the best physical properties of III-V semiconductors and devices could be married with the characteristics of the silicon manufacturing processes. However in recent years, the renewed interest in such heterogeneous technology is fueled by the interest to create an integrated system in silicon to continue to miniaturize with enhanced performance. Although the challenges to monolithically integrate III-V semiconductors with silicon began primarily as a technical investigation of GaAs epitaxial growth on silicon substrates, higher level technical solutions must be provided in the context of manufacturing to bridge viable short, medium and long term applications. In this talk, I shall describe our focus in research in III-V/Si monolithic integration in the context of materials science challenges, suggesting possible solutions to heterogeneous substrate issues that allow for silicon process integration and manufacturing, as well as producing monolithic III-V/Si integrated devices that could be enablers for future high performance platforms. I shall summarize the talk by speculating on the nature of applications that can potentially drive the integrated devices into the marketplace.","PeriodicalId":136293,"journal":{"name":"International Conference on Compilers, Architecture, and Synthesis for Embedded Systems","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2009-10-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Compilers, Architecture, and Synthesis for Embedded Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1145/1629395.1629399","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0

Abstract

Integration of III-V compound semiconductors with silicon on a monolithic platform has been a long term vision for the semiconductor industry. In the past, this concept began as a simple notion that the best physical properties of III-V semiconductors and devices could be married with the characteristics of the silicon manufacturing processes. However in recent years, the renewed interest in such heterogeneous technology is fueled by the interest to create an integrated system in silicon to continue to miniaturize with enhanced performance. Although the challenges to monolithically integrate III-V semiconductors with silicon began primarily as a technical investigation of GaAs epitaxial growth on silicon substrates, higher level technical solutions must be provided in the context of manufacturing to bridge viable short, medium and long term applications. In this talk, I shall describe our focus in research in III-V/Si monolithic integration in the context of materials science challenges, suggesting possible solutions to heterogeneous substrate issues that allow for silicon process integration and manufacturing, as well as producing monolithic III-V/Si integrated devices that could be enablers for future high performance platforms. I shall summarize the talk by speculating on the nature of applications that can potentially drive the integrated devices into the marketplace.
III-V/Si集成:集成低功耗微纳米系统的潜力与前景
将III-V类化合物半导体与硅集成在单片平台上一直是半导体行业的长期愿景。在过去,这一概念始于一个简单的概念,即III-V半导体和器件的最佳物理性能可以与硅制造工艺的特性相结合。然而,近年来,人们对这种异质技术的兴趣重新燃起,因为他们希望在硅上创建一个集成系统,以继续小型化并提高性能。尽管将III-V半导体与硅单片集成的挑战主要是对硅衬底上GaAs外延生长的技术研究,但必须在制造背景下提供更高水平的技术解决方案,以连接可行的短期、中期和长期应用。在这次演讲中,我将描述我们在材料科学挑战背景下对III-V/Si单片集成的研究重点,提出针对异质衬底问题的可能解决方案,这些问题允许硅工艺集成和制造,以及生产可能成为未来高性能平台的单片III-V/Si集成器件。我将通过推测应用程序的本质来总结这次演讲,这些应用程序有可能推动集成设备进入市场。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:604180095
Book学术官方微信