Process Improvements for 7th Generation 1Tb Quad-Level Cell 3D NAND Flash Memory in Mass Production

Soochan Chung, Dong-Hyeon Ko, Joonsung Lim, Kyung-Hee Kim, Sejie Takaki, Y. Seo, Byoungil Lee, Sejun Park, Jaeduk Lee, K. Noh, Sungjin Ahn, Sunghoi Hur
{"title":"Process Improvements for 7th Generation 1Tb Quad-Level Cell 3D NAND Flash Memory in Mass Production","authors":"Soochan Chung, Dong-Hyeon Ko, Joonsung Lim, Kyung-Hee Kim, Sejie Takaki, Y. Seo, Byoungil Lee, Sejun Park, Jaeduk Lee, K. Noh, Sungjin Ahn, Sunghoi Hur","doi":"10.1109/IMW56887.2023.10145937","DOIUrl":null,"url":null,"abstract":"Over the past few decades, a greater need for 3D Vertical NAND (V-NAND) flash memory storage capacity has emerged. Compared to its prevailing technical predecessor, a quad-level cell (QLC) NAND flash memory can be a perfect replacement to meet the needs for the higher density and lower cost non-volatile memory market. However, despite these benefits, QLC’s market share has not been growing significantly because of its worse device reliability and slower performance. In this Paper, a new highly mass-producible and highly reliable 1Tb QLC 3D NAND flash memory with 176-word-line (WL) and Cell-Over-Peripheral (COP) architecture along with a number of significant process advancements will be presented.","PeriodicalId":153429,"journal":{"name":"2023 IEEE International Memory Workshop (IMW)","volume":"102 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2023-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2023 IEEE International Memory Workshop (IMW)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IMW56887.2023.10145937","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1

Abstract

Over the past few decades, a greater need for 3D Vertical NAND (V-NAND) flash memory storage capacity has emerged. Compared to its prevailing technical predecessor, a quad-level cell (QLC) NAND flash memory can be a perfect replacement to meet the needs for the higher density and lower cost non-volatile memory market. However, despite these benefits, QLC’s market share has not been growing significantly because of its worse device reliability and slower performance. In this Paper, a new highly mass-producible and highly reliable 1Tb QLC 3D NAND flash memory with 176-word-line (WL) and Cell-Over-Peripheral (COP) architecture along with a number of significant process advancements will be presented.
量产第7代1Tb四阶单元3D NAND快闪记忆体的制程改进
在过去的几十年里,出现了对3D垂直NAND (V-NAND)闪存存储容量的更大需求。与现有的技术相比,四电平单元(QLC) NAND闪存可以完美地满足高密度和低成本非易失性存储器市场的需求。然而,尽管有这些好处,由于其较差的设备可靠性和较慢的性能,QLC的市场份额并没有显著增长。本文将介绍一种具有176字行(WL)和Cell-Over-Peripheral (COP)架构的新型高量产和高可靠性的1Tb QLC 3D NAND闪存,以及一些重要的工艺进步。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
求助全文
约1分钟内获得全文 求助全文
来源期刊
自引率
0.00%
发文量
0
×
引用
GB/T 7714-2015
复制
MLA
复制
APA
复制
导出至
BibTeX EndNote RefMan NoteFirst NoteExpress
×
提示
您的信息不完整,为了账户安全,请先补充。
现在去补充
×
提示
您因"违规操作"
具体请查看互助需知
我知道了
×
提示
确定
请完成安全验证×
copy
已复制链接
快去分享给好友吧!
我知道了
右上角分享
点击右上角分享
0
联系我们:info@booksci.cn Book学术提供免费学术资源搜索服务,方便国内外学者检索中英文文献。致力于提供最便捷和优质的服务体验。 Copyright © 2023 布克学术 All rights reserved.
京ICP备2023020795号-1
ghs 京公网安备 11010802042870号
Book学术文献互助
Book学术文献互助群
群 号:481959085
Book学术官方微信