Significant role of cold carriers for dielectric breakdown in HfSiON

I. Hirano, T. Yamaguchi, K. Sekine, M. Takayanagi, K. Eguchi, Y. Tsunashima, H. Satake
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引用次数: 6

Abstract

Dielectric breakdown mechanisms in HfSiON were thoroughly investigated by utilizing the substrate hot carrier injection. It was found that the total hole fluence (Q/sub p/) dose not dominate the breakdown in HfSiON. Furthermore, it was experimentally clarified that the injected electrons into HfSiON have the significant role for the breakdown, irrespective of their potential energy. This result strongly suggests that the roles of injected cold electrons in HfSiON are remarkably different from those in SiO/sub 2/ and SiON.
冷载流子在HfSiON介质击穿中的重要作用
利用基片热载子注入技术深入研究了HfSiON介质击穿机理。结果表明,总空穴能量(Q/sub p/)不主导氢氟核聚变的击穿。此外,实验还表明,注入到HfSiON中的电子对击穿具有重要作用,而与它们的势能无关。这一结果有力地说明了注入冷电子在HfSiON中的作用与在SiO/ sub2 /和SiON中的作用有显著的不同。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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