Development of packaged UWB passive devices using LCP multilayer circuit technology

Abstract

A novel method for near-hermetic packaging of integrated UWB passive devices based on multilayer liquid crystal polymer technology is presented in this paper. The aim of this work is to develop a cheap, easy-to-manufacture procedure that can be used to enclose already designed devices without the need of any redesign, and works up to 20GHz. To achieve this, a coplanar waveguide-to-microstrip (CPW-MS) transition is designed to connect the enclosed device with the outer environment. This allows for the device to be PCB mounted as well as providing isolation. Two experiments are presented to validate this approach: an enclosed MS line, in order to measure the losses introduced by the packaging; and then a real ultra wideband (UWB) filter replacing the MS line using the same packaging. Simulated and measured results are provided in order to validate this approach.