CHAPTER 13. Debondable Adhesive Systems

Nicolas Schüwer, Reichard Vendamme
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引用次数: 1

Abstract

The chapter provides an outlook for debondable adhesive systems, i.e. a bonding formulation wherein the degree of adhesion can be reversibly or irreversibly decreased in a selective manner. The technologies reviewed are presented from a user perspective and arranged by the external stimulus required to change the stickiness of adhesive coatings. Both fundamental research and commercial products are discussed within this section.
第13章。可脱粘粘合剂系统
本章提供了可脱粘粘合剂系统的前景,即粘合配方,其中粘合程度可以以选择性的方式可逆或不可逆地降低。综述的技术是从用户的角度出发,并根据改变胶粘剂涂层粘性所需的外部刺激进行安排。本节讨论基础研究和商业产品。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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