{"title":"Demonstration of flexible encapsulation in assembly industry","authors":"Chao-Wei Liu, Ming-Hung Chen, Tun-Ching Pi, Jen-Chieh Kao, Yung-I Yeh","doi":"10.1109/ectc51906.2022.00161","DOIUrl":null,"url":null,"abstract":"An encapsulated sample with high flexibility was demonstrated in this work, which decreased 99.98% of rigidity and had also passed through workability, reliability, and flexible endurance qualifications. This breakthrough has dramatically changed our traditional concept from rigid encapsulation to flexible encapsulation and provides more opportunities for assembly industry. Flexible encapsulation technology which is flexible, bendable, twistable, rollable and foldable had passed through reliability and severe flexible endurance tests. First of all, the flexible encapsulation material decrease 99.98% of rigidity and modulus compared to traditional EMC, which offers an opportunity for the encapsulated product to become flexible even after assembly. In addition, the flexible encapsulation material has good workability and can become massively productive by simple process within assembly industry. Furthermore, the flexibly encapsulated product had passed through several reliability challenges, such as six times multi-reflow with peak temperature of 260°C, preconditioning level 3 (168hours, 30°C, 60% room humidity), and temperature humidity test (THT) with strict condition (192hours, 85°C, 85% room humidity). Last but not least, the encapsulated product overcame the flexible endurance test (folding, rolling and twisting 100,000 cycles) which is impossible to be tested using traditionally encapsulated product.","PeriodicalId":139520,"journal":{"name":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","volume":null,"pages":null},"PeriodicalIF":0.0000,"publicationDate":"2022-05-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ectc51906.2022.00161","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
An encapsulated sample with high flexibility was demonstrated in this work, which decreased 99.98% of rigidity and had also passed through workability, reliability, and flexible endurance qualifications. This breakthrough has dramatically changed our traditional concept from rigid encapsulation to flexible encapsulation and provides more opportunities for assembly industry. Flexible encapsulation technology which is flexible, bendable, twistable, rollable and foldable had passed through reliability and severe flexible endurance tests. First of all, the flexible encapsulation material decrease 99.98% of rigidity and modulus compared to traditional EMC, which offers an opportunity for the encapsulated product to become flexible even after assembly. In addition, the flexible encapsulation material has good workability and can become massively productive by simple process within assembly industry. Furthermore, the flexibly encapsulated product had passed through several reliability challenges, such as six times multi-reflow with peak temperature of 260°C, preconditioning level 3 (168hours, 30°C, 60% room humidity), and temperature humidity test (THT) with strict condition (192hours, 85°C, 85% room humidity). Last but not least, the encapsulated product overcame the flexible endurance test (folding, rolling and twisting 100,000 cycles) which is impossible to be tested using traditionally encapsulated product.