Demonstration of flexible encapsulation in assembly industry

Chao-Wei Liu, Ming-Hung Chen, Tun-Ching Pi, Jen-Chieh Kao, Yung-I Yeh
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Abstract

An encapsulated sample with high flexibility was demonstrated in this work, which decreased 99.98% of rigidity and had also passed through workability, reliability, and flexible endurance qualifications. This breakthrough has dramatically changed our traditional concept from rigid encapsulation to flexible encapsulation and provides more opportunities for assembly industry. Flexible encapsulation technology which is flexible, bendable, twistable, rollable and foldable had passed through reliability and severe flexible endurance tests. First of all, the flexible encapsulation material decrease 99.98% of rigidity and modulus compared to traditional EMC, which offers an opportunity for the encapsulated product to become flexible even after assembly. In addition, the flexible encapsulation material has good workability and can become massively productive by simple process within assembly industry. Furthermore, the flexibly encapsulated product had passed through several reliability challenges, such as six times multi-reflow with peak temperature of 260°C, preconditioning level 3 (168hours, 30°C, 60% room humidity), and temperature humidity test (THT) with strict condition (192hours, 85°C, 85% room humidity). Last but not least, the encapsulated product overcame the flexible endurance test (folding, rolling and twisting 100,000 cycles) which is impossible to be tested using traditionally encapsulated product.
柔性封装在装配行业的示范
在本工作中展示了一种具有高柔性的封装样品,该样品的刚度降低了99.98%,并且通过了可加工性、可靠性和柔性耐久性的认证。这一突破极大地改变了我们从刚性封装到柔性封装的传统观念,为装配行业提供了更多的机会。柔性封装技术具有柔性、可弯曲、可扭转、可卷曲、可折叠等特点,通过了可靠性试验和严格的柔性耐久性试验。首先,与传统EMC相比,柔性封装材料的刚度和模量降低了99.98%,这为封装后的产品即使在组装后也具有柔性提供了机会。此外,柔性封装材料具有良好的可加工性,在装配工业中可以通过简单的工艺实现大规模生产。此外,柔性封装产品还通过了峰值温度260℃的6次多次回流、3级预处理(168小时,30℃,60%室温湿度)、严格条件(192小时,85℃,85%室温湿度)的温湿度测试(THT)等多项可靠性挑战。最后但并非最不重要的是,封装产品克服了传统封装产品无法测试的柔性耐久性测试(折叠,滚动和扭转100,000次)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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