A Hollow-GCPW (HGCPW) as Low-Loss and Wafer-Conductivity-Free Structure on a Single Silicon Wafer

T. Nishino, Y. Yoshida, Y. Suehiro, Sang-Seok Lee, K. Miyaguchi, Tatsuya Fukall1i, H. Oh-Hashi, O. Ishida
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引用次数: 4

Abstract

A low-loss hollow grounded co-planar Waveguide (HGCPW) suitable for a transmission line on a low-resistivity silicon wafer is presented. The HGCPW is disposed in a newly developed dielectric-air-metal (DAM) cavity. which consists of an SiN membrane above a fully metallized cavity made by a micromachining process. Low-loss property is achieved by removing substrate between a signal line and grounds. Existence of a bottom ground metal realizes wafer-conducthity-free structure on a low-resistivity silicon wafer by isolating the line from the substrate completely. Also, the bottom ground enables the impedance to be 50 ohm with narrow line width. HGCPWs on the 6-¿m and 30-¿m DAM cavities were fabricated and tested. The measured losses were about 0.3 dB/mm and 0.1 dB/mm respectively at 12 GHz.
单晶片上低损耗、无晶圆导电性的中空gcpw结构
提出了一种适用于低阻硅片传输线的低损耗空心接地共面波导(HGCPW)。HGCPW被放置在一个新开发的介电-空气-金属(DAM)腔中。它由一层由微机械加工过程制成的全金属化腔之上的SiN膜组成。低损耗特性是通过去除信号线和地线之间的基板来实现的。底部接地金属的存在通过将线路与衬底完全隔离,在低电阻硅片上实现了无晶圆导电性结构。此外,底部接地使阻抗为50欧姆,线宽窄。在6- m和30- m DAM空腔上制作并测试了hgcpw。在12 GHz时,测量到的损耗分别约为0.3 dB/mm和0.1 dB/mm。
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