T. Nishino, Y. Yoshida, Y. Suehiro, Sang-Seok Lee, K. Miyaguchi, Tatsuya Fukall1i, H. Oh-Hashi, O. Ishida
{"title":"A Hollow-GCPW (HGCPW) as Low-Loss and Wafer-Conductivity-Free Structure on a Single Silicon Wafer","authors":"T. Nishino, Y. Yoshida, Y. Suehiro, Sang-Seok Lee, K. Miyaguchi, Tatsuya Fukall1i, H. Oh-Hashi, O. Ishida","doi":"10.1109/EUMA.2003.340821","DOIUrl":null,"url":null,"abstract":"A low-loss hollow grounded co-planar Waveguide (HGCPW) suitable for a transmission line on a low-resistivity silicon wafer is presented. The HGCPW is disposed in a newly developed dielectric-air-metal (DAM) cavity. which consists of an SiN membrane above a fully metallized cavity made by a micromachining process. Low-loss property is achieved by removing substrate between a signal line and grounds. Existence of a bottom ground metal realizes wafer-conducthity-free structure on a low-resistivity silicon wafer by isolating the line from the substrate completely. Also, the bottom ground enables the impedance to be 50 ohm with narrow line width. HGCPWs on the 6-¿m and 30-¿m DAM cavities were fabricated and tested. The measured losses were about 0.3 dB/mm and 0.1 dB/mm respectively at 12 GHz.","PeriodicalId":156210,"journal":{"name":"2003 33rd European Microwave Conference, 2003","volume":"43 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2003-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"4","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2003 33rd European Microwave Conference, 2003","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EUMA.2003.340821","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 4
Abstract
A low-loss hollow grounded co-planar Waveguide (HGCPW) suitable for a transmission line on a low-resistivity silicon wafer is presented. The HGCPW is disposed in a newly developed dielectric-air-metal (DAM) cavity. which consists of an SiN membrane above a fully metallized cavity made by a micromachining process. Low-loss property is achieved by removing substrate between a signal line and grounds. Existence of a bottom ground metal realizes wafer-conducthity-free structure on a low-resistivity silicon wafer by isolating the line from the substrate completely. Also, the bottom ground enables the impedance to be 50 ohm with narrow line width. HGCPWs on the 6-¿m and 30-¿m DAM cavities were fabricated and tested. The measured losses were about 0.3 dB/mm and 0.1 dB/mm respectively at 12 GHz.