Solutions to optoelectronic interconnect problems

2005 OSA Topical Meeting on Information Photonics (IP) Pub Date : 2005-06-06 DOI:10.1364/AOPT.2005.JWB2

S. Kumpatla, J. J. Casswell, J.F. Snowdon

引用次数: 0

Abstract

Optoelectronic bonding has been performed onto sample MCMs, which are to be used for optical testing on HOLMS demonstrator. The photodiodes and VCSELs were successfully bonded, but we experienced problems attaching the Mixed Signal chips.

查看原文本刊更多论文

光电互连问题的解决方案

光电键合已在样品mcm上进行，该样品将用于HOLMS演示器的光学测试。光电二极管和vcsel成功结合，但我们遇到了连接混合信号芯片的问题。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

2005 OSA Topical Meeting on Information Photonics (IP)

自引率

0.00%

发文量