Investigation of mechanism of corrosion resistance of Pd coated Cu wire joint by pseudo process

Abstract

Palladium (Pd) has played a big role to improve the corrosion resistance of copper (Cu) wire. To examine the corrosion resistance of Cu wire, the Cu/Al interface obtained by sputtering [1] was evaluated. In particular, the effect of Pd on Cu wire joints was investigated by preparing pseudo Palladium Coated Copper (PCC) samples and varying the Pd concentration. In this paper, pseudo PCC wire joint samples were evaluated for corrosion resistance and the results compared with those from actual Cu and PCC wire joint samples.