{"title":"Singulation Characteristics of Semiconductor Package Using Pulsed Fiber Laser and SHG:YAG Laser","authors":"Y. Okamoto, R. Kitada, A. Okada, Y. Uno","doi":"10.2526/IJEM.19.28","DOIUrl":null,"url":null,"abstract":"A laser singulation method by the superposition of a pulsed fiber laser and an SHG:YAG laser (SHG: Second Harmonic Generation) was proposed to perform the high-quality processing of semiconductor packages, which are consisted of thermosetting epoxy-resin with silica as the molding compounds and a glass epoxy board with insulator coatings for the semiconductor package. The superposition of the pulsed fiber laser and SHG:YAG laser with a high pulse repetition rate led to a straighter kerf shape with a smaller kerf width under the same pulse energy condition. A smaller kerf width was achieved by controlling the time-delay between the laser pulses compared with synchronized laser pulses. The heat affected zone from the cut surface was reduced by the superposition of the pulsed fiber laser and SHG:YAG laser. Moreover, synchronized laser pulses led to a smaller heat affected zone compared with unsynchronized pulses.","PeriodicalId":407646,"journal":{"name":"International Journal of Electrical Machining","volume":"134 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2014-03-31","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Journal of Electrical Machining","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.2526/IJEM.19.28","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
A laser singulation method by the superposition of a pulsed fiber laser and an SHG:YAG laser (SHG: Second Harmonic Generation) was proposed to perform the high-quality processing of semiconductor packages, which are consisted of thermosetting epoxy-resin with silica as the molding compounds and a glass epoxy board with insulator coatings for the semiconductor package. The superposition of the pulsed fiber laser and SHG:YAG laser with a high pulse repetition rate led to a straighter kerf shape with a smaller kerf width under the same pulse energy condition. A smaller kerf width was achieved by controlling the time-delay between the laser pulses compared with synchronized laser pulses. The heat affected zone from the cut surface was reduced by the superposition of the pulsed fiber laser and SHG:YAG laser. Moreover, synchronized laser pulses led to a smaller heat affected zone compared with unsynchronized pulses.