Singulation Characteristics of Semiconductor Package Using Pulsed Fiber Laser and SHG:YAG Laser

Y. Okamoto, R. Kitada, A. Okada, Y. Uno
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Abstract

A laser singulation method by the superposition of a pulsed fiber laser and an SHG:YAG laser (SHG: Second Harmonic Generation) was proposed to perform the high-quality processing of semiconductor packages, which are consisted of thermosetting epoxy-resin with silica as the molding compounds and a glass epoxy board with insulator coatings for the semiconductor package. The superposition of the pulsed fiber laser and SHG:YAG laser with a high pulse repetition rate led to a straighter kerf shape with a smaller kerf width under the same pulse energy condition. A smaller kerf width was achieved by controlling the time-delay between the laser pulses compared with synchronized laser pulses. The heat affected zone from the cut surface was reduced by the superposition of the pulsed fiber laser and SHG:YAG laser. Moreover, synchronized laser pulses led to a smaller heat affected zone compared with unsynchronized pulses.
脉冲光纤激光器和SHG:YAG激光器半导体封装的仿真特性
提出了一种脉冲光纤激光器与SHG:YAG激光器(SHG:二次谐波产生)叠加的激光模拟方法,用于半导体封装的高质量加工,该封装由热固性环氧树脂和二氧化硅作为模塑化合物,玻璃环氧板和绝缘体涂层组成。脉冲光纤激光器与高脉冲重复率的SHG:YAG激光器叠加,在相同脉冲能量条件下,切口形状更直,切口宽度更小。与同步激光脉冲相比,通过控制激光脉冲间的延时,实现了更小的切口宽度。通过脉冲光纤激光器与SHG:YAG激光器的叠加,减小了切割表面的热影响区。此外,同步激光脉冲产生的热影响区比非同步激光脉冲小。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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