Manufacturing data: Maximizing value using component-to-system analysis

Abstract

This poster will provide a high-level description of Cisco's manufacturing process including how, where and in what form data is collected at various test steps. Trade offs are described to optimize test time and diagnostics for any failing parts in order to provide actionable data for failure analysis. The principal goal of the poster is to raise awareness regarding base component requirements for embedded instrumentation to allow for optimal diagnostic results and speed. Also how synchronized data sharing with stake holders can optimize closed loop corrective action, resources and quality.