Y. Mori, H. Yabuki, M. Ohba, M. Sagawa, M. Makimoto, I. Shibazaki
{"title":"Miniaturized RF-circuit modules for land mobile communication equipment","authors":"Y. Mori, H. Yabuki, M. Ohba, M. Sagawa, M. Makimoto, I. Shibazaki","doi":"10.1109/VETEC.1990.110297","DOIUrl":null,"url":null,"abstract":"Compact RF circuit modules using multilayered printed circuit boards (M-PCBs) are described. The theoretical analysis of split-ring resonators and spiral inductors, fundamental RF circuits elements embedded in M-PCBs, is presented. RF circuit modules, such as a frequency synthesizer, a phase-locked loop modulator, an up-converter, and a receiver front-end are demonstrated to be applicable to land mobile communication equipment. RF circuit modules using M-PCBs have a structure suitable for excellent antivibration characteristics, and the size of the newly developed modules has been reduced to one-quarter of that of conventional modules designed by surface-mount technology.<<ETX>>","PeriodicalId":366352,"journal":{"name":"40th IEEE Conference on Vehicular Technology","volume":"42 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1990-05-06","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"40th IEEE Conference on Vehicular Technology","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/VETEC.1990.110297","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Compact RF circuit modules using multilayered printed circuit boards (M-PCBs) are described. The theoretical analysis of split-ring resonators and spiral inductors, fundamental RF circuits elements embedded in M-PCBs, is presented. RF circuit modules, such as a frequency synthesizer, a phase-locked loop modulator, an up-converter, and a receiver front-end are demonstrated to be applicable to land mobile communication equipment. RF circuit modules using M-PCBs have a structure suitable for excellent antivibration characteristics, and the size of the newly developed modules has been reduced to one-quarter of that of conventional modules designed by surface-mount technology.<>