{"title":"Comparison of Conductive Ribbons Reliability during Electrical Current Ageing","authors":"M. Hirman, J. Navrátil, F. Steiner, A. Hamácek","doi":"10.1109/Diagnostika49114.2020.9214774","DOIUrl":null,"url":null,"abstract":"This paper deals with reliability of soldered/glued joints on electrically conductive textile ribbons during the electrical current ageing. The soldering was realized with tin-bismuth solder paste by hand soldering with hot air. The gluing was realized by UV curable non-conductive adhesive. The electrical resistance of soldered/glued joints on ribbons before, during and after electrical current load was satisfactory. The experiment provided proof that soldered/glued SMD chip components onto electrically conductive textile ribbons is possible and these joints are still usable under the electrical current load. It follows that tested types of joints on ribbon can be recommended for future use.","PeriodicalId":428555,"journal":{"name":"2020 International Conference on Diagnostics in Electrical Engineering (Diagnostika)","volume":"241 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-09-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"1","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 International Conference on Diagnostics in Electrical Engineering (Diagnostika)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/Diagnostika49114.2020.9214774","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 1
Abstract
This paper deals with reliability of soldered/glued joints on electrically conductive textile ribbons during the electrical current ageing. The soldering was realized with tin-bismuth solder paste by hand soldering with hot air. The gluing was realized by UV curable non-conductive adhesive. The electrical resistance of soldered/glued joints on ribbons before, during and after electrical current load was satisfactory. The experiment provided proof that soldered/glued SMD chip components onto electrically conductive textile ribbons is possible and these joints are still usable under the electrical current load. It follows that tested types of joints on ribbon can be recommended for future use.