Impact of the solder joint ageing on IGBT I–V characteristics using 2D physical simulations

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems Pub Date : 2011-04-18 DOI:10.1109/ESIME.2011.5765829

E. Marcault, M. Breil, A. Bourennane, P. Tounsi, P. Dupuy

引用次数: 3

Abstract

Based on 2D mechanical and physical simulations, we explore the impact of solder joint ageing at the origin of power assembly failures, on the electrical characteristics of multi IGBT cells. Electrical characteristics variations are analyzed with the aim of using them for health monitoring of embedded power assemblies.

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利用二维物理模拟研究焊点老化对IGBT I-V特性的影响

基于二维力学和物理模拟，我们探讨了电源组件故障起源处的焊点老化对多个IGBT电池电气特性的影响。分析了电特性变化，目的是将其用于嵌入式电源组件的健康监测。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2011 12th Intl. Conf. on Thermal, Mechanical & Multi-Physics Simulation and Experiments in Microelectronics and Microsystems

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