Wall Shear Stress Measurement Using an SOI CMOS Multisensor MEMS Chip

Y. Javed, M. Mansoor
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Abstract

Monitoring of aerodynamic parameters in real time has always been an area of interest for researchers. These parameters are critically required for designing and optimizing aerodynamic shapes as well as experimentally validating CFD results. Wall shear stress is an important aerodynamic parameter that defines skin friction drag on the body. However, its precise measurement has always remained a challenging task due to high spatial and temporal resolution. Introduction of MEMS technology has provided a solution to this problem. This paper presents use of a novel MEMS sensor fabricated through silicon-on-insulator (SOI) Complementary Metal Oxide Semiconductor (CMOS) technology for measurement of wall shear stress. Sensor is based on hot-wire transduction mechanism that works on heat transfer principle. Sensor sensitivity upto 1 pascal has been demonstrated through customized data acquisition system and characterization setup. Shear stress sensor exhibited a sensitivity of 940 m V /pa at 18mA current. Targeted application areas are real time flow monitoring, active flow control, micro fluidics and wind tunnel testing.
基于SOI CMOS多传感器MEMS芯片的壁剪应力测量
空气动力学参数的实时监测一直是研究人员感兴趣的领域。这些参数对于设计和优化气动形状以及实验验证CFD结果至关重要。壁面剪切应力是决定物体表面摩擦阻力的重要气动参数。然而,由于其高时空分辨率,其精确测量一直是一项具有挑战性的任务。MEMS技术的引入为这一问题提供了解决方案。本文介绍了一种利用绝缘体上硅(SOI)互补金属氧化物半导体(CMOS)技术制造的新型MEMS传感器,用于测量墙体剪切应力。传感器是基于热传导原理的热线转导机构。通过定制的数据采集系统和表征设置,传感器灵敏度高达1帕斯卡。剪切应力传感器在18mA电流下的灵敏度为940 m V /pa。目标应用领域是实时流量监测、主动流量控制、微流体和风洞测试。
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