Effect of the various doping concentration of BF2+ on polysilicon-gate PMOS

Abduazimkhodjaev Aziz, N. S. Zamani
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Abstract

This paper presents the effect of various doping concentration of BF2+polysilicon from 1011 to 1020 (atoms/cm3) for PMOS device using SILVACO TCAD (Technology Computer Aided Design) software. The threshold voltage of polysilicon obtain from ID-VGS curve was analyzed. The results show that BF2+ at dose 1014 to 1019 (atoms/cm3) giving the better characteristics of the PMOS at the threshold voltage between 1.0V to 1.3V. The resistivity of the polysilicon is gradually decreased as a concentration of doping increase, while the conductivity is reciprocal of the resistivity. The resistivity of polysilicon varies considerably depending upon the requirement in PMOS applications. To determine the better doping, the leakage current can be extracted from the I-V curve.
不同浓度BF2+掺杂对多晶硅栅PMOS的影响
利用SILVACO TCAD (Technology Computer Aided Design)软件研究了不同浓度的BF2+多晶硅掺杂对PMOS器件的影响,掺杂浓度为1011 ~ 1020(原子/立方厘米)。对从ID-VGS曲线得到的多晶硅的阈值电压进行了分析。结果表明,在阈值电压为1.0V ~ 1.3V时,BF2+剂量为1014 ~ 1019(原子/cm3)的PMOS具有较好的特性。多晶硅的电阻率随着掺杂浓度的增加而逐渐降低,而电导率是电阻率的倒数。多晶硅的电阻率根据PMOS应用中的要求变化很大。为了确定更好的掺杂方式,可以从I-V曲线中提取漏电流。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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