4H-SiC and Si Based IGBTs/VDMOSFETs Characters Comparison

Shoucai Yuan, Qi Zhang, Yamei Liu, Yi Zhang
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引用次数: 1

Abstract

In order to compare the performance differences of IGBTs/VDMOSFETs based on wide bandgap material 4H-SiC and silicon(Si), the basic theory of semiconductor physics for 4H-SiC and Si was used to describe the quantitative relationship of carrier mobility with doping concentration, output I-V curves with devices design and fabrication parameters, switching characteristics with material properties and devices rating voltage. MATLAB software was used to calculate those above characteristics, the calculation results show that, for given doping concentration, the carrier mobility of 4H-SiC is lower than that of silicon, so its conducting output currents are also smaller than that of silicon in the same design rule of same chip area and same devices terminal bias conditions, for example, when 4H-SiC and Si with same doping concentration of 1015cm-3 and same bias conditions of gate-source voltage 18V/drain-source voltage 2V, the carrier mobility and conducting current are 990.9cm2/V/s and 6.686mA for 4H-SiC, which is only about 74.4% and 55.9% that of silicon with value of 1332.0cm2/V/s and 11.950mA, respectively. However, for devices breakdown voltage of 4000V, the turn-on time for 4H-SiC, 27.88ns, is shorter than that of silicon, 110.30ns, this is because the wide bandgap material 4H-SiC will have higher epilayer doping concentration and thinner epilayer thickness when compared with silicon for given devices blocking voltage, this will lead the more fast turn-on and switching characteristics of 4H-SiC devices than that of Si devices.
基于4H-SiC和Si的igbt / vdmosfet特性比较
为了比较基于宽禁带材料4H-SiC和硅(Si)的igbt / vdmosfet的性能差异,利用半导体物理学的基本理论,描述了载流子迁移率与掺杂浓度、输出I-V曲线与器件设计和制造参数、开关特性与材料性能和器件额定电压的定量关系。利用MATLAB软件对上述特性进行了计算,计算结果表明,在给定掺杂浓度下,4H-SiC的载流子迁移率低于硅,因此在相同芯片面积和相同器件终端偏置条件下,其导电输出电流也小于硅,例如:在同样掺杂浓度为1015cm-3、同样偏置条件为栅极电压18V/漏极电压2V时,4H-SiC的载流子迁移率和导电电流分别为990.9cm2/V/s和6.686mA,仅为硅的1332.0cm2/V/s和11.950mA的74.4%和55.9%左右。然而,当器件击穿电压为4000V时,4H-SiC的导通时间为27.88ns,短于硅的110.30ns,这是因为在给定器件阻断电压下,宽禁带材料4H-SiC与硅相比具有更高的脱膜掺杂浓度和更薄的脱膜厚度,这将导致4H-SiC器件比Si器件具有更快的导通和开关特性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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