Integrated 155M-10Gbps Framer with 22.5Gbps Low/High Order Cross Connect SoC

IEEE Custom Integrated Circuits Conference 2006 Pub Date : 2006-09-01 DOI:10.1109/CICC.2006.321002

K. Venkataraman, V. Suresh, S. Iyengar, M. Ott, S. R. Kalari, J. Zhi, E. Ruetz, M. Gray, B. Reynov, A. Iqbal

引用次数: 1

Abstract

The advent of broadband services requires multi service provisioning platforms (MSPP) to achieve >10Gbps capacity with 1-4 rack unit footprint, power <200W and cost <$10K. Highly integrated SoC using 0.13mu CMOS 19.3times19.3mm die packaged in a 1517 FCBGA affords a unique MSPP solution consisting of 155M-10Gbps SONET/SDH framing, low/high order path processing, grooming, cross-connection up to 22.5Gbps and an embedded processor. A rigorous methodology enabled a production-worthy SoC comprising 9Mgates/14Mbit memory

查看原文本刊更多论文

集成155M-10Gbps帧与22.5Gbps低/高阶交叉连接SoC

宽带业务的出现需要多业务配置平台(MSPP)在1-4个机架单元占地面积、功率<200W、成本< 1万美元的情况下实现bbb10 gbps的容量。高度集成的SoC采用1517 FCBGA封装的0.13mu CMOS 19.3times19.3mm芯片，提供独特的MSPP解决方案，包括15m - 10gbps SONET/SDH帧，低/高阶路径处理，修饰，高达22.5Gbps的交叉连接和嵌入式处理器。严格的方法使SoC具有生产价值，包括9Mgates/14Mbit内存

本文章由计算机程序翻译，如有差异，请以英文原文为准。

求助全文

约1分钟内获得全文求助全文

来源期刊

IEEE Custom Integrated Circuits Conference 2006

自引率

0.00%

发文量