Do's and don'ts in thermal management

R. Moffat
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引用次数: 2

Abstract

This paper presents some observations and recommendations about thermal management based on my experience as a researcher, teacher, and consultant. These comments are focused mainly on air cooling, at the system and board level. It is important to integrate the testing and CFD approaches to problems and have their results interpreted by someone well-schooled in heat transfer. Data doesn't solve a problem, data simply makes the problem visible. It takes a trained person to solve a thermal problem-someone who can look at the data, recognizes the root cause of the problem, and who knows what to change to fix it. Every house needs one. CFD codes are mainly used to identify potential problems. They can do more. It is not difficult to instruct a CFD code to generate diagnostic data that will help reveal the nature of the problem-not just that a problem exists. It is increasingly important to have a working knowledge of heat exchanger theory and to keep that viewpoint in mind when looking at larger-scale problems, like heat sinks. Recent advances in micro-scale manufacture of heat transfer surfaces show promise of new ultra-compact heat exchangers that will fit in to the electronics environment. That field bears watching.
热管理要做和不要做
本文根据我作为研究人员、教师和顾问的经验,提出了一些关于热管理的观察和建议。这些评论主要集中在系统和电路板层面的空气冷却。重要的是将测试和CFD方法结合起来解决问题,并由在传热方面受过良好教育的人来解释他们的结果。数据并不能解决问题,数据只是让问题显现出来。解决热问题需要一个训练有素的人——一个能够查看数据、认识到问题根源并知道如何解决问题的人。每户人家都需要一个。CFD代码主要用于识别潜在问题。他们可以做得更多。指示CFD代码生成有助于揭示问题本质(而不仅仅是问题存在)的诊断数据并不困难。掌握热交换器理论的工作知识,并在研究诸如散热器之类的大规模问题时牢记这一观点,变得越来越重要。最近在微型传热表面制造方面的进展表明,新的超紧凑热交换器将适合电子环境。这个领域值得关注。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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