{"title":"PCB design techniques for the SI and EMC of Gb/s differential transmission lines","authors":"K. Armstrong","doi":"10.1109/EMCZUR.2006.214945","DOIUrl":null,"url":null,"abstract":"Differential transmission lines are increasingly employed to carry very high data rates in serial communications in printed circuit boards (PCBs). This paper provides an overview of a number of signal integrity (SI) and electromagnetic compatibility (EMC) problems with differential lines in PCBs. It also describes design techniques that can help achieve good SI and EMC","PeriodicalId":130489,"journal":{"name":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","volume":"33 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2006-05-15","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2006 17th International Zurich Symposium on Electromagnetic Compatibility","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EMCZUR.2006.214945","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
Differential transmission lines are increasingly employed to carry very high data rates in serial communications in printed circuit boards (PCBs). This paper provides an overview of a number of signal integrity (SI) and electromagnetic compatibility (EMC) problems with differential lines in PCBs. It also describes design techniques that can help achieve good SI and EMC