Analysis of aperture-coupled multi-layer microstrip antennas

P. Besso, D. Finotto, D. Forigo, P. Gianola
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引用次数: 4

Abstract

The authors present a generalization to an arbitrary number of dielectric substrates and patches of the full-wave analysis of aperture coupled microstrip antennas developed to evaluate its input impedance. This approach also makes it possible to consider aspects related to manufacturing, such as the effects of the glue used to bond the various substrates and the effects of a possible radome. Using this technique, stacked antennas can be designed and analyzed in terms of input impedance. In order to verify the theory and the relevant computer code a single aperture-coupled patch antenna was realized and tested. Measurements of the input impedance versus frequency show good agreement with the theory.<>
孔径耦合多层微带天线分析
作者将孔径耦合微带天线的全波分析推广到任意数目的介电基片和贴片,以评估其输入阻抗。这种方法还可以考虑与制造相关的方面,例如用于粘合各种基材的胶水的影响以及可能的天线罩的影响。利用这种技术,可以根据输入阻抗来设计和分析堆叠天线。为了验证理论和相关的计算机代码,实现并测试了一个单孔耦合贴片天线。输入阻抗随频率变化的测量结果与理论相符。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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