Diamond SAW Resonator

S. Fujii, Toonoe Haruki, Yasunori Shiba
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引用次数: 1

Abstract

Diamond is known to have the highest sound velocity of all materials, and therefore, has been applied to high frequency surface acoustic wave (SAW) devices in SHF bands. Our earlier research has shown much potential for diamond SAW resonators and filters on single crystal substrates at frequencies above 3 GHz. However, single crystal diamond wafers of only up to two-inch in diameter have been realized; in consequence, diamond SAW resonators were far from commercial development. A novel CMOS device fabrication system developed by Hara et al., called the Minimal-Fab process, was thus applied in the fabrication of SAW resonators. It utilizes a half-inch diameter wafer, and proceeds with device fabrication via half-micron fine pattern, without needing a cleanroom. Here, we discuss the potential of the Minimal-fab process, and our fabrication of diamond SAW resonators using it, where we used a half-inch diamond wafer.
金刚石SAW谐振器
众所周知,金刚石是所有材料中声速最高的材料,因此,金刚石已被应用于高频表面声波(SAW)器件的SHF波段。我们早期的研究表明,在频率高于3ghz的单晶衬底上,金刚石SAW谐振器和滤波器具有很大的潜力。然而,单晶金刚石晶圆的直径只有2英寸;因此,金刚石SAW谐振器远未实现商业化开发。Hara等人开发的一种新型CMOS器件制造系统,称为Minimal-Fab工艺,因此被应用于SAW谐振器的制造。它利用半英寸直径的晶圆,通过半微米的精细图案进行器件制造,无需洁净室。在这里,我们讨论了Minimal-fab工艺的潜力,以及我们使用它制造的金刚石SAW谐振器,其中我们使用了半英寸的金刚石晶圆。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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