{"title":"Damage Initiation in Bonded Particulate Networks: 3D Simulations","authors":"L. Berhan, C. Wang, A. M. Sastry","doi":"10.1115/imece2001/ad-25304","DOIUrl":null,"url":null,"abstract":"\n Several promising Li-ion technologies incorporate micro- and nanoarchitectured carbon networks, typically in the form of whisker/particle blends bonded with thermoplastic binders, in the electrodes. Degradation of these battery electrode materials is currently a persistent problem, with damage presenting as blistering and/or delamination. We are investigating bonding in micro- and nanostructured materials in order to predict onset of this degradation of these stochastic materials. Here, we describe a general methodology in modeling the small junctures in these porous network materials. We have found previously that the joint properties are the controlling feature in a significant class of materials, and suggest that 3D simulations on the bonds may be used in 2D simulations of overall network behavior.","PeriodicalId":442756,"journal":{"name":"Damage Initiation and Prediction in Composites, Sandwich Structures and Thermal Barrier Coatings","volume":"17 9","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-11-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Damage Initiation and Prediction in Composites, Sandwich Structures and Thermal Barrier Coatings","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1115/imece2001/ad-25304","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Several promising Li-ion technologies incorporate micro- and nanoarchitectured carbon networks, typically in the form of whisker/particle blends bonded with thermoplastic binders, in the electrodes. Degradation of these battery electrode materials is currently a persistent problem, with damage presenting as blistering and/or delamination. We are investigating bonding in micro- and nanostructured materials in order to predict onset of this degradation of these stochastic materials. Here, we describe a general methodology in modeling the small junctures in these porous network materials. We have found previously that the joint properties are the controlling feature in a significant class of materials, and suggest that 3D simulations on the bonds may be used in 2D simulations of overall network behavior.