Advances of Gate Stack Technology in MOSFETs

Lefu Xie
{"title":"Advances of Gate Stack Technology in MOSFETs","authors":"Lefu Xie","doi":"10.1109/TOCS56154.2022.10015955","DOIUrl":null,"url":null,"abstract":"In this digital era, an increasing number of semiconductor manufacturing companies have developed thinner and cheaper circuit components, such as diodes, MOSFETs, and FinFETs. At the same time, gate stack technology is also introduced in MOSFETs to help solve the problem posed by short channel effects. There are a large number of researches on different MOSFETs using gate stack technology, therefore, this paper is a literature review of three different kinds of gate stacked MOSFETs and their behavior against short channel effects. The MOSFETs discussed in this paper are investigated in 2017, 2018 and 2020, and the ability of weakening short channel effects is also analyzed. Drain-induced barrier lowering (DIBL), threshold voltage roll-off, and subthreshold swing are three common short channel effects, and though the improvement in gate stack technology, they are suppressed in some degree. Gate stack technology has been developing new possibilities and it is expected that gate stack MOSFETs are much more powerful in confronting short channel effects and they will play a key role in different fields in the future.","PeriodicalId":227449,"journal":{"name":"2022 IEEE Conference on Telecommunications, Optics and Computer Science (TOCS)","volume":"14 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2022-12-11","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2022 IEEE Conference on Telecommunications, Optics and Computer Science (TOCS)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/TOCS56154.2022.10015955","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
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Abstract

In this digital era, an increasing number of semiconductor manufacturing companies have developed thinner and cheaper circuit components, such as diodes, MOSFETs, and FinFETs. At the same time, gate stack technology is also introduced in MOSFETs to help solve the problem posed by short channel effects. There are a large number of researches on different MOSFETs using gate stack technology, therefore, this paper is a literature review of three different kinds of gate stacked MOSFETs and their behavior against short channel effects. The MOSFETs discussed in this paper are investigated in 2017, 2018 and 2020, and the ability of weakening short channel effects is also analyzed. Drain-induced barrier lowering (DIBL), threshold voltage roll-off, and subthreshold swing are three common short channel effects, and though the improvement in gate stack technology, they are suppressed in some degree. Gate stack technology has been developing new possibilities and it is expected that gate stack MOSFETs are much more powerful in confronting short channel effects and they will play a key role in different fields in the future.
mosfet中栅极堆叠技术的研究进展
在这个数字时代,越来越多的半导体制造公司已经开发出更薄、更便宜的电路元件,如二极管、mosfet和finfet。同时,栅极堆叠技术也被引入到mosfet中,以帮助解决短通道效应带来的问题。利用栅极堆叠技术对不同的mosfet进行了大量的研究,因此,本文对三种不同的栅极堆叠mosfet及其对短沟道效应的性能进行了文献综述。本文讨论的mosfet分别在2017年、2018年和2020年进行了研究,并分析了削弱短通道效应的能力。漏极势垒降低(DIBL)、阈值电压滚降和亚阈值摆幅是三种常见的短通道效应,通过栅极叠加技术的改进,它们在一定程度上得到了抑制。栅极堆叠技术正在发展新的可能性,栅极堆叠mosfet在对抗短沟道效应方面具有更强大的能力,并将在未来的不同领域发挥关键作用。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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