Protective Layer for Collective Die to Wafer Hybrid Bonding

Abstract

Blade dicing compatible particle protective layer is investigated for feasibility study of collective Die-to- Wafer (D2W) direct bonding. Having the compatibility to blade dicing, the protective layer needs to be insoluble for de-ionized water (DIW), because blade dicing requires cooling water to maintain the cutting performance. Therefore, polymers soluble in alkaline solutions (e.g. TMAH, NH4OH), however, insoluble in DIW are tested for collective die to wafer direct bonding. With the dicing particle protective layer technology, successful collective die to wafer direct bonding with current die assembly tools are achieved. The alternative protective layer ensures high yield and cost of ownership for collective die to wafer integration