Protective Layer for Collective Die to Wafer Hybrid Bonding

F. Inoue, J. Bertheau, S. Suhard, A. Phommahaxay, T. Ohashi, T. Kinoshita, Y. Kinoshita, E. Beyne
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引用次数: 4

Abstract

Blade dicing compatible particle protective layer is investigated for feasibility study of collective Die-to- Wafer (D2W) direct bonding. Having the compatibility to blade dicing, the protective layer needs to be insoluble for de-ionized water (DIW), because blade dicing requires cooling water to maintain the cutting performance. Therefore, polymers soluble in alkaline solutions (e.g. TMAH, NH4OH), however, insoluble in DIW are tested for collective die to wafer direct bonding. With the dicing particle protective layer technology, successful collective die to wafer direct bonding with current die assembly tools are achieved. The alternative protective layer ensures high yield and cost of ownership for collective die to wafer integration
晶圆与晶圆混合键合的保护层
为研究集体模晶直接结合的可行性,对刀片切割相容颗粒保护层进行了研究。在对刀片切割具有相容性的同时,保护层需要不溶于去离子水(DIW),因为刀片切割需要冷却水来保持切割性能。因此,可溶于碱性溶液(如TMAH, NH4OH),而不溶于DIW的聚合物进行了集体晶圆直接键合测试。采用切削颗粒保护层技术,成功实现了与现有模具组装工具的集体模具与晶圆直接结合。替代保护层确保了高成品率和拥有成本的集体模具晶圆集成
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