Non-contact 10% efficient 36mW power delivery using on-chip inductor in 0.18-μm CMOS

Abstract

This paper presents design and implementation of an inductive coupling power delivery system between stacked chips in 0.18-mum CMOS process. Two conventional high-power rectifier structures are compared, and a new topology is proposed. With a pair of fully optimized 700 mum times 700 mum on-chip inductors, the test chip achieves 10% peak efficiency and 36 mW power transmission. Compared with previous published chip-to-chip wireless power transmission systems, the received power is 13 times larger.