Microwave plasma-assisted deposition of boron doped single crystal diamond

T. Grotjohn, A. Bhattacharya, S. Zajac
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Abstract

The homoepitaxial growth of diamond on single crystal substrates is done using microwave plasma-assisted chemical vapor deposition with a hydrogen-methane plasma. The doping of the deposited diamond with boron makes it a p-type semiconductor and with phosphorus makes it an n-type semiconductor. The doping of diamond is done to make diamond electronic devices. Diamond is of interest for electronics as it has a wide bandgap (5.4 eV), the highest thermal conductivity of all solid materials at room temperature, a high electric field breakdown strength (10 MV/cm), and high hole and electron carrier mobilities. This presentation will describe the boron doping of diamond by adding diborane into the feedgas of the plasma discharge. For electronic devices controlled doping levels of the boron in the diamond from 1015 cm-3 up to above 1020 cm-3 are desired. The primary control of the doping level is the amount of diborane added to the feedgas. Levels of diborane concentrations in the feedgas as measured by the [B]/[C] ratio in the feedgas range from 0.3 ppm to over 1000 ppm in our study. While the diborane concentration in the feedgas is of primary importance many other factors are also important to the boron concentration in the diamond including residual boron in the deposition system from previous runs, temperature of the substrate, preparation of the substrate, and conditions of the plasma discharge including its power density and pressure. An additional consideration in the doping of diamond is keeping unwanted impurities out of the deposition process. This is especially true of nitrogen impurities which are easily incorporated into the diamond during deposition and which compensates the boron doping, especially at low boron doping concentrations. This presentation will discuss measures taken in the design and operation of a microwave plasma diamond deposition system to control the boron doping and reduce the unwanted impurities.
微波等离子体辅助沉积硼掺杂单晶金刚石
利用微波等离子体辅助化学气相沉积技术,在单晶衬底上实现了金刚石的同外延生长。沉积金刚石与硼掺杂使其成为p型半导体,与磷掺杂使其成为n型半导体。金刚石的掺杂是用来制造金刚石电子器件的。金刚石具有宽的带隙(5.4 eV),室温下所有固体材料中导热系数最高,高电场击穿强度(10 MV/cm)以及高空穴和电子载流子迁移率,因此对电子学很感兴趣。本报告将介绍通过在等离子体放电的原料气中加入二硼烷来掺杂金刚石的方法。对于电子器件,金刚石中硼的掺杂水平需要控制在1015 cm-3到1020 cm-3以上。掺杂水平的主要控制是添加到原料气中的二硼烷的量。在我们的研究中,用[B]/[C]比值测量的原料气中二硼烷浓度水平从0.3 ppm到1000 ppm以上。虽然原料气中的二硼烷浓度是最重要的,但许多其他因素对金刚石中的硼浓度也很重要,包括沉积系统中以前运行的残余硼、衬底的温度、衬底的制备以及等离子体放电的条件(包括功率密度和压力)。金刚石掺杂的另一个考虑因素是在沉积过程中保持不需要的杂质。氮杂质尤其如此,在沉积过程中,氮杂质很容易融入金刚石中,并补偿硼掺杂,特别是在低硼掺杂浓度下。本报告将讨论在微波等离子体金刚石沉积系统的设计和操作中采取的措施,以控制硼掺杂和减少不必要的杂质。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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