Temperature Coefficient of Frequency in Silicon-Based Cross-Sectional Quasi Lam e; Mode Resonators

S. Shahraini, R. Abdolvand, Hedy Fatemi
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引用次数: 4

Abstract

Temperature coefficient of frequency (TCF) is studied in silicon-based cross-sectional quasi Lamé modes (CQLMs). Such modes are demonstrated in thin-film piezoelectric-on-silicon (TPoS) resonators and the TCF curves are modeled using eigenfrequency analysis in COMSOL for highly n-type doped silicon. It is shown that the ratio between the finger-pitch and the resonator thickness affects the turnover temperature of these resonators which could be predicted using this model. The CQLM-TPoS resonators fabricated on a $40\mu\mathbf{m}$ thick SOI substrate, are characterized and the measured TCF values are confirmed to be in close agreement with the prediction. A relatively high turnover temperature of >100°C is reported for a third-order CQLM-TPoS resonator aligned to <100> silicon plane while a turnover temperature of <20°C is recorded for the <110> counterpart.
硅基截面准电极的频率温度系数模式谐振器
研究了硅基截面准lam模的频率温度系数(TCF)。这些模式在薄膜压电硅(TPoS)谐振器中得到了证明,并在COMSOL中使用特征频率分析对高n型掺杂硅的TCF曲线进行了建模。结果表明,指距与谐振腔厚度的比值对谐振腔的翻转温度有影响,该模型可以预测谐振腔的翻转温度。在$40\mu\mathbf{m}$厚的SOI衬底上制备的CQLM-TPoS谐振器进行了表征,并证实了测量的TCF值与预测非常吻合。本文报道了三阶CQLM-TPoS谐振器的翻转温度>100°C,而翻转温度则相对较高。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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