Thin Film Transfer Components for Cheap MICs

Abstract

A solution to the problem of pattern definition, which sometimes exists in the production of cheap MICs, is described. The process (l) involves the transfer of high definition, thin film style, component patterns from a carrier to the main substrate. The concept allows common substrates to be tailored to individual requirements and promises the use of low cost MICs to be extended in frequency. The performance of components transferred into thick film and copper laminate style circuits is compared with wholly thin film constructed items.