Analysis of Interface Trap Charges on Dielectric Pocket SOI-TFET

C. Pandey, Avtar Singh, S. Chaudhury
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引用次数: 4

Abstract

In this brief, the reliability of SOI-TFET with dielectric pocket (DP SOI-TFET) has been investigated in the presence of fixed trap charges at the interface between dielectric pocket (DP) and drain region. During numerical simulation, both types of trap charges like donor (i.e. positive) and acceptor (i.e. negative) have been considered to analyse the impact on the performance of SOI-TFET having DP in drain region used for reduction of ambipolar conduction. We have compared the device performances such as ambipolar conduction, and OFF-state current of conventional SOI-TFET with both low and high- $\pmb{k}$ DP SOI-TFET in the presence of interface trap charges (ITCs). It has been found that SOI-TFET is more immune to interface trap charges when high- $\pmb{k}$ material is used as DP compared to low- $\pmb{k}$. Since, high- $\pmb{k}$ provides even more reduction in ambipolar conduction as compared to low- $\pmb{k}$, it can be preferred to be used a dielectric pocket in SOI-TFET.
介电口袋型SOI-TFET的界面陷阱电荷分析
本文研究了介电袋(DP)与漏极区交界面存在固定陷阱电荷时SOI-TFET (DP)的可靠性。在数值模拟过程中,考虑了供体(即正)和受体(即负)两种类型的陷阱电荷,分析了在漏极区有DP对SOI-TFET性能的影响,用于减少双极导通。我们比较了在界面陷阱电荷(ITCs)存在下,传统SOI-TFET与低DP和高DP SOI-TFET的器件性能,如双极导通和关闭状态电流。研究发现,与低pmb{k}$相比,高pmb{k}$材料作为DP时,SOI-TFET对界面陷阱电荷的免疫能力更强。由于与低pmb{k}$相比,高pmb{k}$提供了更多的双极导通降低,因此它可以首选用于SOI-TFET中的介电袋。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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