{"title":"Thermoelastic damping dependent quality factor analysis of rectangular plates applying modified coupled stress theory","authors":"R. Resmi, M. Baiju, V. Babu","doi":"10.1063/1.5131616","DOIUrl":null,"url":null,"abstract":"Thermoelastic damping plays an essential role among the different energy dissipation mechanisms and should be minimized in MEMS/NEMS based resonators for enhancing its performance parameters. In this paper, the different performance indices analyzed are quality factor, thermoelastic frequency and figure of merit of the resonator using five different structural materials (polySi, diamond, Si, GaAs and SiC). Figure of merit is the product of quality factor and thermoelastic frequency which should be maximized in order to provide better sensitivity and noise rejection for resonators. As the size of the devices is scaled down, classical continuum theories are not able to explain the size effect related mechanical behaviour at micron or submicron levels and as a result non-classical continuum theories are employed with the inception of internal length scale parameters. Analysis of isotropic rectangular micro-plates based on Kirchhoff model applying M odified Coupled Stress Theory is used to analyze the size-dependent thermoelastic damping and its impact on quality factor and subsequently on Figure of Merit of the resonator. It is found that the QTED of the beams predicted by the non-classical MCST based model are larger than that predicted by the classical beam model. The descending material order in which QTED varies is polySi>Si>diamond>GaAs>SiC. Maximum and minimum ω is achieved for diamond and GaAs respectively. Maximum figure of merit is obtained for polySi with a value of 1.29*1014 and that of minimum is for GaAs (1.77*1011). The material order in which the figure of merit QTED * ωi changes is the same as that for quality factor change and the order in which it varies is PolySi>Diamond>Si>SiC>GaAs. The numerical analysis is done by using MATLAB R 2015a.","PeriodicalId":435771,"journal":{"name":"INTERNATIONAL CONFERENCE ON INVENTIVE MATERIAL SCIENCE APPLICATIONS : ICIMA 2019","volume":"18 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2019-10-25","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"7","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"INTERNATIONAL CONFERENCE ON INVENTIVE MATERIAL SCIENCE APPLICATIONS : ICIMA 2019","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1063/1.5131616","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 7
Abstract
Thermoelastic damping plays an essential role among the different energy dissipation mechanisms and should be minimized in MEMS/NEMS based resonators for enhancing its performance parameters. In this paper, the different performance indices analyzed are quality factor, thermoelastic frequency and figure of merit of the resonator using five different structural materials (polySi, diamond, Si, GaAs and SiC). Figure of merit is the product of quality factor and thermoelastic frequency which should be maximized in order to provide better sensitivity and noise rejection for resonators. As the size of the devices is scaled down, classical continuum theories are not able to explain the size effect related mechanical behaviour at micron or submicron levels and as a result non-classical continuum theories are employed with the inception of internal length scale parameters. Analysis of isotropic rectangular micro-plates based on Kirchhoff model applying M odified Coupled Stress Theory is used to analyze the size-dependent thermoelastic damping and its impact on quality factor and subsequently on Figure of Merit of the resonator. It is found that the QTED of the beams predicted by the non-classical MCST based model are larger than that predicted by the classical beam model. The descending material order in which QTED varies is polySi>Si>diamond>GaAs>SiC. Maximum and minimum ω is achieved for diamond and GaAs respectively. Maximum figure of merit is obtained for polySi with a value of 1.29*1014 and that of minimum is for GaAs (1.77*1011). The material order in which the figure of merit QTED * ωi changes is the same as that for quality factor change and the order in which it varies is PolySi>Diamond>Si>SiC>GaAs. The numerical analysis is done by using MATLAB R 2015a.
热弹性阻尼在各种能量耗散机制中起着至关重要的作用,在基于MEMS/NEMS的谐振器中应尽量减少热弹性阻尼,以提高其性能参数。本文分析了五种不同结构材料(多晶硅、金刚石、硅、砷化镓和碳化硅)谐振器的质量因子、热弹性频率和优值。优值是质量因子和热弹性频率的乘积,为了给谐振器提供更好的灵敏度和噪声抑制,应该最大化热弹性频率。随着器件尺寸的缩小,经典连续统理论无法解释微米或亚微米水平上与尺寸效应相关的力学行为,因此采用了非经典连续统理论,并引入了内部长度尺度参数。基于Kirchhoff模型,应用M修正耦合应力理论对各向同性矩形微板进行了分析,分析了尺寸相关的热弹性阻尼及其对谐振器质量因子和优值图的影响。结果表明,采用非经典MCST模型预测的梁的QTED比经典模型预测的梁的QTED大。QTED的变化顺序为多晶硅>硅>金刚石>砷化镓>SiC。金刚石和GaAs的ω值分别达到最大值和最小值。多晶硅的最大优点值为1.29*1014,砷化镓的最小优点值为1.77*1011。材料品质系数QTED * ωi变化的顺序与品质因子变化的顺序相同,其变化的顺序为多晶硅>金刚石>Si>SiC>GaAs。利用MATLAB R 2015a进行数值分析。