{"title":"The NCSU Cadence Design Kit for IC Fabrication through MOSIS","authors":"T. Schaffer, A. Stanaski, A. Glaser, P. Franzon","doi":"10.1109/MSE.1999.10002","DOIUrl":null,"url":null,"abstract":"We describe the Cadence Design kit prepared at NCSU for downloading and use by other Universities. In addition, the talk to be given at the Conference will describe how commercial CAD tools are integrated and used in our microelectronics cirriculum from sophomore through to graduate years.","PeriodicalId":358674,"journal":{"name":"International Conference on Microelectronics Systems Education","volume":"60 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-07-19","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"International Conference on Microelectronics Systems Education","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/MSE.1999.10002","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We describe the Cadence Design kit prepared at NCSU for downloading and use by other Universities. In addition, the talk to be given at the Conference will describe how commercial CAD tools are integrated and used in our microelectronics cirriculum from sophomore through to graduate years.