Sensitivity Of The RF Performance Of GaAs Power FETs To Process-dependent Parameters

M. Khatibzadeh, R. Trew
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引用次数: 6

Abstract

In recent years, the rapid growth of the Monolithic Microwave Integrated Circuits (MMICs) market has spurred considerable interest in large-signal modeling of GaAs MESFETs. An accurate Computer Aided Design (CAD) tool for the GaAs MESFET is important to the economic viability of MMIC technology. The design of microwave circuits for small-signal applications has substantially benefited from linear characterization techniques such as S-parameters. It is difficult, however, to apply this methodology to the design of microwave circuits for high-power applications in which nonlinear effects are dominant. There are three empirical techniques presently used in the characterization of power FETs: 1) the load pull method[ll, 2) "large-signal S-parameter" measurement[2], and 3 ) characterization by means of small signal S-parameters measured at different bias voltages [ 3 ] . These empirical methods, however, require that the device be fabricated prior to large signal characterization. Therefore, unless a systematic, controlled experiment on several devices is performed, little information can be gained from these techniques about the relation between large signal performance and device parameters.
GaAs功率场效应管射频性能对工艺相关参数的敏感性
近年来,单片微波集成电路(mmic)市场的快速增长激发了人们对GaAs mesfet大信号建模的极大兴趣。精确的GaAs MESFET计算机辅助设计(CAD)工具对于MMIC技术的经济可行性至关重要。用于小信号应用的微波电路的设计很大程度上得益于s参数等线性表征技术。然而,将这种方法应用于非线性效应占主导地位的高功率微波电路的设计是困难的。目前有三种经验技术用于功率场效应管的表征:1)负载拉法[1,2]。“大信号s参数”测量[2],以及3)在不同偏置电压下测量的小信号s参数表征[3]。然而,这些经验方法要求在大信号表征之前制造器件。因此,除非在几个设备上进行系统的、受控的实验,否则从这些技术中很难获得关于大信号性能和设备参数之间关系的信息。
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