Lateral oxidation of AlAs thin films

Z. Liliental-Weber, O. Richter, W. Świder, M. Li, G.S. Li, C. Chang-Hasnain, E. Weber
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引用次数: 0

Abstract

Transmission electron microscopy was used for characterization of microstructure resulting from wet oxidation of AlAs layers of different thicknesses separated by a 20 nm thick GaAs layer. In general, the oxidation rate was related to the AlAs layer thickness, but some deviation from this rule was observed for layer thicknesses in the range of 65 to 30 nm. Accumulation of As precipitates at the AlAs/GaAs/AlAs interfaces and in the GaAs separation layers was observed. A build up of stress at these interfaces occasionally caused formation of stacking faults close to the oxidation front. Large differences in interface abruptness were observed for direct (AlAs on GaAs) and inverted (GaAs on AlAs) interfaces. The oxidation front was asymmetric with the faster front close to the inverted interface.
AlAs薄膜的侧向氧化
采用透射电子显微镜对20 nm厚GaAs层分隔的不同厚度的AlAs层湿氧化后的微观结构进行了表征。总的来说,氧化速率与AlAs层厚度有关,但在65 ~ 30 nm的层厚度范围内,氧化速率与此规律有所偏差。在AlAs/GaAs/AlAs界面和GaAs分离层中观察到As沉淀的积累。在这些界面处应力的积累偶尔会在靠近氧化锋处形成层错。直接(砷化镓上的砷化镓)和反向(砷化镓上的砷化镓)界面的界面突然性有很大差异。氧化锋是不对称的,较快的氧化锋靠近倒界面。
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