SPICE sensitivity analysis of a bipolar test structure during process development

Abstract

This paper presents a methodology for predicting the effect of process input parameter variation on SPICE parameters early in the development of a new process. This is achieved by using TCAD generated measurement data calibrated from test structure measurement data gathered from an initial process. This methodology enables the same extraction strategy to be performed on TCAD and physical measurement data throughout the development of a semiconductor process ensuring data integrity. This assists both the process integration engineer and the design engineer in the optimisation of a process.