Juhyoung Lee, Sangyeob Kim, Sangjin Kim, Wooyoung Jo, Donghyeon Han, Jinsu Lee, H. Yoo
{"title":"OmniDRL: A 29.3 TFLOPS/W Deep Reinforcement Learning Processor with Dualmode Weight Compression and On-chip Sparse Weight Transposer","authors":"Juhyoung Lee, Sangyeob Kim, Sangjin Kim, Wooyoung Jo, Donghyeon Han, Jinsu Lee, H. Yoo","doi":"10.23919/VLSICircuits52068.2021.9492504","DOIUrl":null,"url":null,"abstract":"This paper presents OmniDRL, a 4.18 TFLOPS and 29.3 TFLOPS/W DRL processor. A group-sparse training core and exponent mean delta encoding are proposed to enable weight and feature map compression for every iteration of DRL training. A sparse weight transposer enables on-chip transpose of compressed weight for reducing external memory access. The processor fabricated in 28 nm CMOS technology and occupies 3.6×3.6 mm2 die area. It achieved 7.16 TFLOPS/W energy efficiency for training robot agent (Mujoco Halfcheetah, TD3), which is 2.4× higher than the previous state-of-the-art.","PeriodicalId":106356,"journal":{"name":"2021 Symposium on VLSI Circuits","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2021-06-13","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"5","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2021 Symposium on VLSI Circuits","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.23919/VLSICircuits52068.2021.9492504","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 5
Abstract
This paper presents OmniDRL, a 4.18 TFLOPS and 29.3 TFLOPS/W DRL processor. A group-sparse training core and exponent mean delta encoding are proposed to enable weight and feature map compression for every iteration of DRL training. A sparse weight transposer enables on-chip transpose of compressed weight for reducing external memory access. The processor fabricated in 28 nm CMOS technology and occupies 3.6×3.6 mm2 die area. It achieved 7.16 TFLOPS/W energy efficiency for training robot agent (Mujoco Halfcheetah, TD3), which is 2.4× higher than the previous state-of-the-art.