Re-targetting manufacturing technologies in multichip module layout

Abstract

The author describes how a multichip module (MCM) may be retargeted from one manufacturing technology to another during the physical layout. Some of the differences in manufacturing techniques of the MCM-C, MCM-L, and MCM-D and the effects that they have on the layout task are discussed. MCM-L uses a laminated circuit board process, MCM-C is a cofired ceramic process, and MCM-D is similar to an IC manufacturing process in which conductive material is deposited on to a silicon substrate. The system consists of both design and analysis tools. Automatic routing up to 48 signal layers and electrical analysis for reflections, crosstalk, and simple thermal analysis are described.<>