A DC-120 GHz SPDT Switch Based on 22 nm FD-SOI SLVT NFETs with Substrate Isolation Rings Towards Increased Shunt Impedance

M. Rack, L. Nyssens, Q. Courte, D. Lederer, J. Raskin
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引用次数: 1

Abstract

A DC-120 GHz SPDT switch is proposed using GlobalFoundries' 22FDX® SLVT devices with improved substrate isolation rings. For mm-wave switch applications, 22FDX® offers BFMOAT devices that include substrate isolation zones beneath them to reduce high-frequency shunt loss, though, compared to SLVT devices, this sacrifices the back-gate functionality, resulting in higher RonCoff. This paper proposes and analyses substrate isolation zones implemented in ring-shapes around SLVT-FETs to reduce parasitic shunt admittance while preserving the back-gate. The resulting effective device boasts a low RonCoff metric (thanks to an SLVT-FET core with back-gate) and simultaneously achieves high substrate impedance to the reference ground node (similar performance as BFMOAT-FETs). From such devices, a full SPDT switch was fabricated and characterized up to 130 GHz. Having less than 2.4 dB insertion loss and better than 22 dB isolation from DC to 120 GHz, it outperforms analogous SPDT modules implemented using conventional SLVT or BFMOAT FETs.
一种基于22 nm FD-SOI SLVT非场效应管的DC-120 GHz SPDT开关,其衬底隔离环增加了分流阻抗
采用GlobalFoundries的22FDX®SLVT器件,改进了衬底隔离环,提出了DC-120 GHz SPDT开关。对于毫米波开关应用,22FDX®提供BFMOAT器件,其下方包括基板隔离区,以减少高频分流损耗,但与SLVT器件相比,这牺牲了后闸功能,导致更高的RonCoff。本文提出并分析了在slvt - fet周围的环形衬底隔离区,以减少寄生分流导纳,同时保留后门。由此产生的有效器件具有低RonCoff度量(由于带有后门的SLVT-FET核心),同时实现了基准地节点的高衬底阻抗(与bfmoat - fet性能相似)。从这些器件中,制造了一个完整的SPDT开关,并表征了高达130 GHz的频率。它的插入损耗小于2.4 dB,从直流到120 GHz的隔离度优于22 dB,优于使用传统SLVT或BFMOAT fet实现的类似SPDT模块。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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