High thermal conductivity epoxy/BN composites with sufficient dielectric breakdown strength

Abstract

Various types of epoxy/BN composites were prepared to optimize material conditions for high thermal conductivity and high breakdown strength. The best composite was found to be epoxy/conglomerated h-BN/ nano silica nano micro composite with thermal conductivity 12 W/m•K and BD strength 15 kVpeak/0.2 mm. One of the most important factors to obtain high values of the two performances is to reduce void content. Surface treatment of fillers and nano filler addition are also useful.