Packaging in the IT environment: competing challenges in the design of packaging for electronic products

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005. Pub Date : 2005-05-06 DOI:10.1109/ISEE.2005.1437000

J. Horbal, M. Schaffer

引用次数: 0

Abstract

Provide an overview of packaging design considerations through modeling and testing to optimize packaging for electronic products and to provide details of the packaging challenge from an environmental perspective.

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IT环境下的封装:电子产品封装设计中的竞争挑战

通过建模和测试来优化电子产品的包装，概述包装设计的考虑因素，并从环境的角度提供包装挑战的细节。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of the 2005 IEEE International Symposium on Electronics and the Environment, 2005.

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