Measurements of solder paste viscosity during its tempering and aging

Proceedings of the 2014 37th International Spring Seminar on Electronics Technology Pub Date : 2014-05-07 DOI:10.1109/ISSE.2014.6887590

K. Dušek, I. Beshajová Pelikánová, D. Bušek, Marek Zeidler

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引用次数: 7

Abstract

Solder paste printing is one of the most important steps in the surface mount technology, which has high influence on the resulting quality of solder joints. To achieve a good joint quality, the solder paste should have specific properties like adhesion, viscosity, size of the solder alloy particles, amount of flux etc. This paper is focused on the measurement of the solder paste viscosity during its tempering and aging with possibility of regeneration of solder paste properties by jelly flux. Three types of solder pastes were used in the experiment: Sn95.5Ag4Cu0.5, Sn96.5Ag3Cu0.5 and Sn62Pb36Ag2. Viscosity of solder paste is measured from storing temperature to the ambient temperature. Aging of solder pastes is made in ambient atmosphere. Regeneration of solder paste properties after aging was done by adding of jelly flux Amtech 4300/LF-4300-TF. The viscosity of pure solder paste before aging, pure solder paste after aging and solder paste after aging regenerated by jelly flux was measured by rotation viscometer Brookfield Synchroelectric Viscometer, model HBT. The article describes if the addition of jelly flux to the aged solder pastes regenerates their properties.

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锡膏在回火和时效过程中的粘度测量

焊膏印刷是表面贴装技术中最重要的步骤之一，对焊点的质量有很大的影响。为了获得良好的连接质量，锡膏应该具有特定的性能，如附着力、粘度、焊料合金颗粒的大小、助焊剂的数量等。本文主要研究了锡膏在回火和时效过程中的粘度测量，以及果冻助焊剂对锡膏性能再生的可能性。实验中使用了三种类型的锡膏:Sn95.5Ag4Cu0.5、Sn96.5Ag3Cu0.5和Sn62Pb36Ag2。锡膏的粘度是从储存温度到环境温度测量的。锡膏的老化是在环境气氛中进行的。通过添加胶状助焊剂Amtech 4300/LF-4300-TF，实现了时效后锡膏性能的再生。采用旋转粘度计，布鲁克菲尔德同步电粘度计，HBT型测量了老化前纯锡膏、老化后纯锡膏和果冻助焊剂再生的老化后锡膏的粘度。本文描述了在老化的锡膏中加入胶状助焊剂是否能使其性能再生。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Proceedings of the 2014 37th International Spring Seminar on Electronics Technology

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