Simplified optical coupling and alignment scheme for cost effective 10 Gbit/s TOSA modules based on edge emitters hermetically packaged in micro-machined silicon structures

Abstract

Packaging of opto-electronic components - as opposed to semiconductor or electronics ICs - requires not only hermeticity but also proper alignment of optical elements. Due to tolerances in the range of a few microns at best, conventional technology usually requires laborious active alignment steps to couple light efficiently into the fiber. A simple optical coupling and alignment scheme is presented which enables the fabrication of cost effective 10 Gbit/s TOSA (transmitter optical sub-assembly) modules which are based on edge-emitting laser diodes packaged hermetically in micro-machined silicon structures.