Structure and simulation of GaAs TUNNETT and MITATT devices for frequencies above 100 GHz

Chien-Chung Chen, R. Mains, G. Haddad, H. Eisele
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引用次数: 5

Abstract

A numerical simulation program for two-terminal transit-time devices based on the energy-momentum transport model, with valence band to conduction band tunneling phenomena incorporated, has been developed. This program can deliver accurate TUNNETT and MITATT device simulation results in the millimeter and submillimeter range, and therefore provides a useful tool for high frequency device structure design and optimization. Simulation results for GaAs TUNNETT and MITATT devices for frequencies above 100 GHz are presented. As simulation results show, the negative resistance of the device decreases rapidly as the operating frequency increases. Under such circumstances, the contact resistance severely degrades the device's RF performance. When a diode's negative resistance becomes lower than the contact resistance, no RF power can be generated. To overcome this difficulty, device structures using no ohmic contacts are investigated. In these devices, ohmic contacts are replaced by Schottky contacts, and also p-n junctions are replaced by Schottky junctions for single-drift structures. Since the metal-semiconductor contact resistance is eliminated or greatly reduced in such devices, they are very promising as RF power sources at extremely high frequencies.<>
频率在100ghz以上的GaAs TUNNETT和MITATT设备的结构和仿真
基于能量动量输运模型,结合价带至导带隧穿现象,编制了双端跃迁时间器件的数值模拟程序。该程序可以在毫米和亚毫米范围内提供精确的TUNNETT和MITATT器件仿真结果,因此为高频器件结构设计和优化提供了有用的工具。给出了频率在100ghz以上的GaAs TUNNETT和MITATT器件的仿真结果。仿真结果表明,随着工作频率的增加,器件的负电阻迅速减小。在这种情况下,接触电阻会严重降低设备的射频性能。当二极管的负电阻低于接触电阻时,不能产生射频功率。为了克服这一困难,研究了不使用欧姆接触的器件结构。在这些器件中,欧姆触点被肖特基触点所取代,单漂移结构的pn结也被肖特基结所取代。由于这种器件消除或大大降低了金属-半导体接触电阻,因此它们非常有希望作为极高频率的射频电源。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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