A flexible fixed-outline floorplanning methodology for mixed-size modules

Kai-Chung Chan, Chao-Jam Hsu, Jiarping Lin
{"title":"A flexible fixed-outline floorplanning methodology for mixed-size modules","authors":"Kai-Chung Chan, Chao-Jam Hsu, Jiarping Lin","doi":"10.1109/ASPDAC.2013.6509635","DOIUrl":null,"url":null,"abstract":"This paper presents a new flow to handle fixed-outline floorplanning for mixed size modules. It consists of two stages, which include global distribution stage and legalization stage. The methodology is very flexible, which can be integrated into other methods or be extended to handle other constraints such as routability or thermal issue. The global distribution stage aims to obtain better wirelength while distributing modules over a fixed outline. Once a good result can be obtained in the first stage, the legalization stage only needs to obtain a feasible solution by maintaining the good result. The legalization is performed by curve merging in a slicing tree, which is obtained by the partition based approach. Two functions are proposed to divide a circuit and the associated placement region into two parts. Although the fixed-outline floorplanning with mixed size modules is very difficult, our method still can obtain better results. The experimental results show that our method can averagely reduce wirelength by 22.5% and 4.7% than PATOMA [1] and DeFer [2] in mixed size benchmarks.","PeriodicalId":297528,"journal":{"name":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-29","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"3","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 18th Asia and South Pacific Design Automation Conference (ASP-DAC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ASPDAC.2013.6509635","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 3

Abstract

This paper presents a new flow to handle fixed-outline floorplanning for mixed size modules. It consists of two stages, which include global distribution stage and legalization stage. The methodology is very flexible, which can be integrated into other methods or be extended to handle other constraints such as routability or thermal issue. The global distribution stage aims to obtain better wirelength while distributing modules over a fixed outline. Once a good result can be obtained in the first stage, the legalization stage only needs to obtain a feasible solution by maintaining the good result. The legalization is performed by curve merging in a slicing tree, which is obtained by the partition based approach. Two functions are proposed to divide a circuit and the associated placement region into two parts. Although the fixed-outline floorplanning with mixed size modules is very difficult, our method still can obtain better results. The experimental results show that our method can averagely reduce wirelength by 22.5% and 4.7% than PATOMA [1] and DeFer [2] in mixed size benchmarks.
一个灵活的固定轮廓的平面规划方法,用于混合大小的模块
本文提出了一种处理混合尺寸模块的固定轮廓平面规划的新流程。它包括两个阶段,即全球分销阶段和合法化阶段。该方法非常灵活,可以集成到其他方法中,也可以扩展到处理其他约束,如可达性或热问题。全球分发阶段的目的是在固定的轮廓上分发模块时获得更好的波长。一旦在第一阶段获得了良好的结果,合法化阶段只需要通过保持良好的结果来获得可行的解决方案。合法化是通过在切片树中进行曲线合并来实现的,该切片树由基于划分的方法得到。提出了两个函数将电路和相关的放置区域划分为两个部分。虽然混合尺寸模块的固定轮廓平面规划非常困难,但我们的方法仍然可以获得较好的结果。实验结果表明,在混合尺寸的基准测试中,我们的方法比PATOMA[1]和DeFer[2]平均减少了22.5%和4.7%的带宽。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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