1D ResNet for Fault Detection and Classification on Sensor Data in Semiconductor Manufacturing

Philip Tchatchoua, G. Graton, M. Ouladsine, Julien Muller, Abraham Traoré, Michel Juge
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引用次数: 3

Abstract

With much attention being placed on reducing manufacturing costs and improving productivity, maintaining process tools in good operating conditions is one of the most important objectives. A huge amount of data is collected during manufacturing processes and the challenge nowadays is to efficiently make use of this massive data. In this paper, a multivariate time-series fault detection method, based on the 1D ResNet algorithm is proposed. The objective is to analyze the raw data, collected via various sensors during the semiconductor manufacturing process in order to detect abnormal wafers. For this, a set of features derived from specific tools in the manufacturing chain are selected and evaluated to characterize the wafer status. Two distinct data sets are used to validate the proposed approach. The results obtained highlight the strengths of the proposed method, which could serve as a valuable decision-making support for abnormal wafer detection in the semiconductor manufacturing process.
半导体制造传感器数据故障检测与分类的一维ResNet方法
随着人们越来越关注降低制造成本和提高生产率,使过程工具处于良好的运行状态是最重要的目标之一。在制造过程中收集了大量数据,目前的挑战是如何有效地利用这些大量数据。本文提出了一种基于一维ResNet算法的多变量时间序列故障检测方法。目的是分析在半导体制造过程中通过各种传感器收集的原始数据,以检测异常晶圆。为此,从制造链中的特定工具中选择并评估一组特征,以表征晶圆状态。两个不同的数据集被用来验证所提出的方法。实验结果显示了该方法的优点,可为半导体制造过程中异常晶圆检测提供有价值的决策支持。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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