Capacity-oriented High-performance NV-TCAM Leveraging Hybrid MRAM Scheme

Didi Zhang, Bi Wu, Haonan Zhu, Weiqiang Liu
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Abstract

As a special type of memory, Ternary Content Addressable Memory (TCAM) has been widely employed in network routers and various applications that require high speed table lookup. However, the large cell area and high static power consumption of traditional CMOS-based TCAMs have always constrained its advance toward higher capacity. Therefore, many non-volatile memory devices, such as ReRAM, FeFET, and MRAM, are emerging in TCAM designs to address these issues. However, SOT-MRAM devices with ultra-high write speed, low power consumption and small cell area are not effectively utilized in TCAM designs due to their low tunnel magnetoresistance (TMR) ratio, etc. In this work, first, combining the ultra-high performance of SOT-MRAM and the reliability of STT-MRAM, a 4T-3MTJ SOT/STT hybrid NV-TCAM structure with ultra-high integration density is proposed. However, to eliminate the lower match line utilization caused by the low TMR of SOT-MRAM, another highly reliable 7T-3MTJ NV-TCAM structure is proposed. Simulation results show that the proposed two TCAM structures can achieve search speed of 0.4ns and 0.15ns with only 4 and 7 transistors, respectively. While maintaining high performance, their write energy is only 0.133pJ/bit, a maximum reduction of 91.6% over existing TCAM designs. Meanwhile, the array-level simulations prove the great potential of the proposed design in terms of integration density and performance.
基于混合MRAM方案的容量导向高性能NV-TCAM
三元内容可寻址存储器(TCAM)作为一种特殊类型的存储器,已广泛应用于网络路由器和各种需要高速查找表的应用中。然而,传统cmos tcam的单元面积大、静态功耗高,一直制约着其向高容量方向发展。因此,许多非易失性存储器件,如ReRAM, FeFET和MRAM,正在TCAM设计中出现,以解决这些问题。然而,具有超高写入速度、低功耗和小单元面积的SOT-MRAM器件由于其低隧道磁阻(TMR)比等原因,无法有效地用于TCAM设计。本文首先结合SOT- mram的超高性能和STT- mram的可靠性,提出了一种超高集成密度的4T-3MTJ SOT/STT混合NV-TCAM结构。然而,为了消除SOT-MRAM低TMR带来的低匹配线利用率,提出了另一种高可靠的7T-3MTJ NV-TCAM结构。仿真结果表明,所提出的两种TCAM结构分别使用4个和7个晶体管即可实现0.4ns和0.15ns的搜索速度。在保持高性能的同时,它们的写入能量仅为0.133pJ/bit,比现有的TCAM设计最大降低了91.6%。同时,阵列级仿真也证明了该设计在集成密度和性能方面的巨大潜力。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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