Realization of an Integrated Planar LC Low-Pass Filter with Modified Surface Micromachining Technology

2005 IEEE Conference on Electron Devices and Solid-State Circuits Pub Date : 2005-12-19 DOI:10.1109/EDSSC.2005.1635379

J. Fang, Z.W. Liu, Z.M. Chen, L.T. Liu, Z.J. Li

引用次数: 5

Abstract

An Integrated Planar LC LPF(Low-Pass Filter) is designed and fabricated with Modified Surface Micromachining. The LPF is accomplished on low-resistance silicon substrate. To increase the performance of the filter, the substrate underneath the devices is modified with OPS (oxided porous silicon) technology. Measurement results give -3dB bandwidth of 2.925GHz and midband insertion loss of 0.874dB at 500MHz.

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改进表面微加工技术的集成平面LC低通滤波器的实现

采用改进表面微加工技术，设计并制作了一种集成平面LC低通滤波器。LPF是在低阻硅衬底上实现的。为了提高过滤器的性能，器件下面的衬底用OPS(氧化多孔硅)技术进行了修改。测量结果表明，在500MHz时-3dB带宽为2.925GHz，中频插入损耗为0.874dB。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2005 IEEE Conference on Electron Devices and Solid-State Circuits

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