Hotspot test structures for evaluating carbon nanotube microfin coolers and graphene-like heat spreaders

Abstract

The design, fabrication, and use of a hotspot-producing and temperature-sensing test structure for evaluating the thermal properties of carbon nanotubes, graphene and boron nitride for cooling of electronic devices in applications like 3D integrated chip-stacks, power amplifiers and light-emitting diodes is described. The test structure is a simple meander-shaped metal resistor serving both as the hotspot and the temperature thermo-meter. By use of this test structure, the influence of emerging materials like those mentioned above on the temperature of the hotspot has been evaluated with good accuracy (±0.5°C).