Characterization of Thermal-Electric Performance of Silicon Power MOSFET Inverter Using Coupled Field Analysis

Yanyan Liao, Y. Shen, H. Cheng, W. Chen
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Abstract

In this paper, a coupled electric-thermal model is proposed to estimate the power loss and thermal performance of power module and three-phase inverter. First, the electrical extraction software is used to obtain parasitic parameters of the package. Then, the temperature field of the package is simulated under certain power by using computational fluid dynamics (CFD). Finally, the results of the electrical extraction and the CFD model are imported into the circuit simulation software to establish an equivalent circuit model for coupled calculation of conduction loss and switching loss under certain boundary condition. The results of the power loss and temperature field are also compared with the experimental data.
用耦合场分析表征硅功率MOSFET逆变器的热电性能
本文提出了一个电-热耦合模型来估计功率模块和三相逆变器的功率损耗和热性能。首先,利用电提取软件获取封装的寄生参数。然后,利用计算流体力学(CFD)对一定功率下的封装温度场进行了模拟。最后,将电提取结果和CFD模型导入电路仿真软件,建立等效电路模型,在一定边界条件下耦合计算导通损耗和开关损耗。功率损耗和温度场的计算结果也与实验数据进行了比较。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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